Qualcomm just recently announced their new ‘7-series’ chipset, the Snapdragon 7s Gen 3 in their press note last August 20, 2024. This chipset is targeted to run mid-tier devices with AI capabilities in mind. 

The chipset will be fabricated in the 4nm process, and its core architecture consists of 1 prime core clocked at 2.5 GHz, 3 performance cores clocked at 2.4 GHz, and 4 efficiency cores clocked at 1.8 GHz. The tech firm claims that this will deliver 20% CPU performance uplift, 40% GPU improvement, and 12% power savings when compared to its predecessor.  

The chip also boasts some AI features like Generative AI support and multi-language translation or transcription. It will also support LLMs which includes Baichuan-7B, Llama 2 and others. The company also claims that this will bring 30% better AI performance than its predecessor.

Snapdragon 7s Gen 3 features

Other notable features of the chip include support for display up to FHD+144Hz, support for LPDDR5 memory up to 3200 MHz and UFS 3.1 for storage, 5G mmWave and Sub-6 GHz, Wi-Fi 6E and Bluetooth 5.4 for connectivity, Spectra Triple ISP technology with 4K@30 fps video recording and up to 200MP photo capture for its camera capabilities, and Adaptive Performance Engine 3.0, Variable Rate Shading, Adreno HDR Fast Blend and Vulkan 1.3 API for its gaming capabilities. 

Snapdragon 7s Gen 3 Documentation
Notable OEMS had already lined up for orders for this chipset, and will use it in their upcoming phones in the future with the likes of Realme, Samsung, Sharp and Xiaomi, in which the latter (Xiaomi) will be the first OEM to use the chipset and will be unveiled in September. 

Source: Qualcomm, Via: GSMArena